Broadband Parasitic Parameters Modeling of Impedance Discontinuous Differential Pair Interconnect Structure in the TSV Package

In order to research the influence on the differential transmission characteristics caused by micro-bump, planar interconnector, flip-chip solder ball and other interconnect structures except for the through silicon via in the TSV package, an improved RLCG circuit model of the differential TSV, which is suitable for describing the "impedance of the differential interconnect structures connected in series" is proposed. Then, a RLCG circuit model of the "impedance discontinuity structure connected in series" which is suitable to describe the micro-bump, planar interconnector, flip-chip solder ball and other interconnect structures used "impedance discontinuity coefficient" is proposed. On this basis, 3D full wave simulation method of HFSS is used to simulate the structure made up of the micro-bump, planar interconnector, flip-chip solder ball and other interconnect structures connected in series. The differential mode forward transmission coefficient of the RLCG model and HFSS model are analyzed and compared. The results show that two RLCG models proposed above can describe the wideband transmission characteristics of differential mode signals accurately in the 0.1~30 GHz, especially in the 3~25 GHz wave band.