姜爽, 刘诗斌, 郭晨光, 彭斌, 樊旭. 通用总线控制器抗SEU加固设计研究[J]. 微电子学与计算机, 2020, 37(12): 81-86.
引用本文: 姜爽, 刘诗斌, 郭晨光, 彭斌, 樊旭. 通用总线控制器抗SEU加固设计研究[J]. 微电子学与计算机, 2020, 37(12): 81-86.
JIANG Shuang, LIU Shi-bin, GUO Chen-guang, PENG Bin, FAN Xu. Research on theoptimized design of anti-SEU for bus controller chip[J]. Microelectronics & Computer, 2020, 37(12): 81-86.
Citation: JIANG Shuang, LIU Shi-bin, GUO Chen-guang, PENG Bin, FAN Xu. Research on theoptimized design of anti-SEU for bus controller chip[J]. Microelectronics & Computer, 2020, 37(12): 81-86.

通用总线控制器抗SEU加固设计研究

Research on theoptimized design of anti-SEU for bus controller chip

  • 摘要: 随着集成电路制造技术的发展, 寄存器和SRAM等存储单元在空间辐射环境中越来越容易受到单粒子翻转(SEU)效应的影响.传统抗SEU加固方法分为工艺加固和设计加固, 前者依赖于工艺平台, 难度大、周期长, 后者仅针对芯片内部特定SEU敏感单元.通过提出一种针对通用总线控制器的芯片级抗SEU加固设计方法, 采用冗余编码和刷新技术, 可以进一步提高芯片的抗SEU能力; 通过划分影响域和添加中断源, 便于定位芯片中SEU敏感位置, 从而有利于片内刷新操作和后续设计优化.实验结果表明, 与传统的辐射加固方法相比, 新方法具有更高的辐射可靠性和容错能力.

     

    Abstract: With the development of integrated circuit manufacturing technology, memory cells such as registers and SRAMs are more and more vulnerable to single-event upset (SEU) effect in space radiation environment. There are two traditional anti-SEU methods, i.e. manufacturing process reinforcement and design reinforcement. The former depends on the process platform, which is difficult and has a long period. The latter is only for specific SEU sensitive elements of the chip. By proposing a chip-level anti-SEU reinforcement design method for an universal bus controller chip, using redundant coding and scrubbing methods, the anti-SEU ability of the chip can be further improved. Meanwhile, by dividing influence domain and adding interrupt sources, the chip's SEU-sensitive elements can be easily identified, which is very convenient for in-system refreshing and subsequent optimization. Verified by SEU experiment, the proposed chip has higher radiation reliability and fault-tolerance than the chip with traditional radiation-hardening methods.

     

/

返回文章
返回