微电子组装翼型引脚焊点三维重构算法研究
Research on Microelectronics Assembly Solder Joint of Wing Pin Three-Dimensional Reconstruction
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摘要: 焊点表面三维重构是微电子组装质量检测与控制技术发展的重点研究内容之一,在基于S FS原理的微电子组装焊点表面三维重构方法中,由于焊点表面同时存在镜面反射和漫反射,使得重构结果不理想。针对这一问题,本研究以翼型引脚焊点的对象,通过对其表面光照反射项进行分析,针对焊点表面及焊点图像的特点,提出一种改进的微电子组装翼型引脚焊点表面三维重构算法。实验结果表明,与基于其他传统光照模型的三维重构方法相比,采用本研究提出的方法重构翼型引脚焊点三维形状结果更加理想。Abstract: Solder joint three-dimensional (3D) reconstruction is one of the key research of microelectronic assembly quality detection and control technology development. During the Solder joint 3D reconstruction based on SFS theroy,the reconstruction results are not ideal because of existing specular reflection and diffuse reflection on solder joint surface.In this study,our focus on wing pin solder joint.At first,the reflection items on solder joint surface are analysised. Then, according to the characteristics of joint surface and solder joint image, a improved 3d reconstruction algorithm is proposed for microelectronics assembly wing pin solder joint.At last,the experimental results have shown that the 3D shape based on the improved illumination model is more satisfactory in decreasing specular reflection influence than that of the traditional methods.
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