陈守维, 王启东, 陈诚, 李君, 曹立强, 陆原. 射频发射前端的小型化及电磁兼容设计[J]. 微电子学与计算机, 2017, 34(6): 58-61.
引用本文: 陈守维, 王启东, 陈诚, 李君, 曹立强, 陆原. 射频发射前端的小型化及电磁兼容设计[J]. 微电子学与计算机, 2017, 34(6): 58-61.
CHEN Shou-wei, WANG Qi-dong, CHEN Cheng, LI Jun, CAO Li-qiang, LU Yuan. RF Front-End of Miniaturization and Electromagnetic Compatibility Design[J]. Microelectronics & Computer, 2017, 34(6): 58-61.
Citation: CHEN Shou-wei, WANG Qi-dong, CHEN Cheng, LI Jun, CAO Li-qiang, LU Yuan. RF Front-End of Miniaturization and Electromagnetic Compatibility Design[J]. Microelectronics & Computer, 2017, 34(6): 58-61.

射频发射前端的小型化及电磁兼容设计

RF Front-End of Miniaturization and Electromagnetic Compatibility Design

  • 摘要: 介绍了一种基于微波板(HL972)工艺的发射前端, 利用场路联合仿真分析了本振链路, 使本振链路具有足够的输出功率和良好的谐波抑制.利用全波仿真工具(HFSS)研究了信号路径的损耗、电磁辐射和器件之间的耦合问题.仿真数据显示, 基片集成波导(SIW)带通滤波器带内插损低于3 dB, 回波损耗大于15 dB.另外, 混频器的RF端口与压控振荡器(VCO)的输出端口最大耦合为-56 dB.这表示两者之间有很好的隔离度.最后研究了射频电路板的电磁兼容设计.

     

    Abstract: This paper demonstrates a novel highly integrated transmitter front-end based on microwave board. By using the field-circuit co-simulation analysis, the local oscillator link is analyzed, which makes the local oscillator have enough output power and good harmonic suppression. Full wave simulation tool (HFSS) is used to study the loss of signal path, the coupling between electromagnetic radiation and device. The Simulation results show, the third substrate integrated waveguide (SIW) BPF insertion loss is less than 3 dB, return loss greater than 15 dB. In addition, The EM coupling between the voltage controlled oscillator (VCO) output and the mixer RF port of the highest coupling is -56 dB, indicating very good isolation. Finally, we study the EMC design RF circuit board.

     

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