陈福栈, 甘业兵, 罗彦彬, 叶甜春. 一种2.4GHz多模块集成CMOS射频前端芯片[J]. 微电子学与计算机, 2020, 37(12): 27-32.
引用本文: 陈福栈, 甘业兵, 罗彦彬, 叶甜春. 一种2.4GHz多模块集成CMOS射频前端芯片[J]. 微电子学与计算机, 2020, 37(12): 27-32.
CHEN Fu-zhan, GAN Ye-bing, LUO Yan-bin, YE Tian-chun. A 2.4GHz multi-module CMOS RF front-end chip[J]. Microelectronics & Computer, 2020, 37(12): 27-32.
Citation: CHEN Fu-zhan, GAN Ye-bing, LUO Yan-bin, YE Tian-chun. A 2.4GHz multi-module CMOS RF front-end chip[J]. Microelectronics & Computer, 2020, 37(12): 27-32.

一种2.4GHz多模块集成CMOS射频前端芯片

A 2.4GHz multi-module CMOS RF front-end chip

  • 摘要: 为提升无线通信终端中射频模组的集成度、降低终端的实现成本,基于0.18 μm CMOS工艺设计了一款2.4 GHz射频前端芯片,片上集成射频功率放大器(PA)、射频低噪声放大器(LNA)、射频开关、基准源电路及数字控制电路,PA和LNA的阻抗匹配网络均采用片上元件实现.测试结果显示,接收模式下,芯片的增益为11.2 dB,输入\输出回波损耗分别为-5.8 dB及-21.1 dB,IIP3为3.9 dBm;发射模式下,芯片增益达26.8 dB,输入\输出回波损耗分别为-21 dB及-14.2 dB,输出1 dB压缩点为23.5 dBm,峰值PAE达24%.本芯片对于2.4 GHz ISM频段通信系统具备一定的应用价值.

     

    Abstract: To improve the integration density of RF front-end modules and reduce the cost of wireless communication terminals, a 2.4GHz RF front-end chip is designed and fabricated based on 0.18um CMOS process. The chip incorporates a power amplifier, a low noise amplifier, a SPST switch, a bandgap circuit and digital control circuit. The impedance matching networks of the PA and the LNA are all implemented on chip. The test results show that in the receiving mode, the chip gain is 11.2dB, the input \ output return loss is -5.8dB and -21.1dB respectively, and the IIP3 is 3.9dbM. In the transmission mode, the chip gain is up to 26.8dB, the input \ output return loss is -21dB and -14.2dB respectively, the output 1dB compression point is 23.5dbm, and the peak PAE is up to 24%. The chip possesses application prospect for 2.4GHz wireless communication systems.

     

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