刘帅锋, 梁远军, 李磊. 单片集成CMOS光接收前端电路设计[J]. 微电子学与计算机, 2011, 28(3): 99-102,107.
引用本文: 刘帅锋, 梁远军, 李磊. 单片集成CMOS光接收前端电路设计[J]. 微电子学与计算机, 2011, 28(3): 99-102,107.
LIU Shuai-feng, LIANG Yuan-jun, LI Lei. Design of Monothic CMOS Optical Receiver Front-End Circuit[J]. Microelectronics & Computer, 2011, 28(3): 99-102,107.
Citation: LIU Shuai-feng, LIANG Yuan-jun, LI Lei. Design of Monothic CMOS Optical Receiver Front-End Circuit[J]. Microelectronics & Computer, 2011, 28(3): 99-102,107.

单片集成CMOS光接收前端电路设计

Design of Monothic CMOS Optical Receiver Front-End Circuit

  • 摘要: 文中采用SMIC 0.18μm CMOS工艺设计了适用于芯片间光互连的的接收机前端放大电路,将跨阻放大器(TIA)和限幅放大器(LA)集成于同一块芯片中,跨阻放大器采用调制型共源共栅(RGC)结构来提高其带宽,限幅放大器采用二阶有源反馈结构和有源电感负载来获得高的增益带宽积.整个接收机前端放大电路具有85dB中频增益,-3dB带宽为4.36GHz.芯片的面积为1mm×0.7mm,在1.8V电源电压下功耗为144mW.

     

    Abstract: An optical receiver front-end circuit suitable for optical connect system was designed in a SMIC 0.18μm CMOS process. The transimpedance amplifier (TIA) and limiting amplifier (LA) are integrated in one chip. TIA uses regulated cascade (RGC) to boost bandwidth. LA uses second-order active feedback architecture and active inductor loads to improve the gain-bandwidth product (GBW). The circuit provides an overall gain of 85dB with a bandwidth of 4.36 GHz. The chip dissipates 144mW from a 1.8V supply with its area of 1.0×0.7mm2.

     

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