32×32位三端口寄存器堆的加固设计
Design of 32×32 Bit 3-port Hardened Register File
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摘要: 为了克服集成电路在辐射环境下所受的影响,在SMIC0.18μm工艺下,设计一款应用于LEON3处理器核中的加固的32×32位三端口寄存器堆.存储单元内部采用改进的双向互锁存储单元(DICE)结构,外围组合电路采用C-element结构.电路模拟结果表明,室温条件下,工作电压为1.8V,寄存器堆工作在200MHz时,能够实现两读一写的功能,并能同时消除单粒子翻转(SEU)和单粒子瞬态(SET)效应.与汉明码加固方式相比,该方法具有较高的抗辐射能力和较快的速度.Abstract: In this paper, a 32×32 bit 3-port hardened register file used in LEON3 processor is implemented in SMIC 0.18μm CMOS technology.Memory cell is formed of DICE that is modified.Peripheral combination circuit is carried out with C-element.The results of circuit simulation show that when the register file work at 200MHz and the temperature is 27℃ with 1.8V power supply, the function of 2-read 1-write can be implemented, and SEU, SET can be avoided at the same time.Compared with hamming coding for register file, the design has higher anti-radiation ability and faster velocity.
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