Abstract: The three-dimensional integrated circuit based on though-silicon-vias has the advantages of low interconnect delay, high density and low power consumption. However, due to the immature technology, the manufacturing, stacking of TSVs and the binding of chips are prone to introduce micro-hole, leakage and other defects, causing TSV faults. Moreover, these TSV faults tend to distribute clustered, which seriously reduces the yield of three-dimensional integrated circuit. A new TSV fault-tolerant architecture for clustered faults based on diamond burster is proposed in this paper. The TSV honeycomb block is divided into several TSV groups by diamond burster, and corresponding repair resources are configured for each group, so as to disperse the clustered TSV faults and repair them one by one. Multiplexer-chains are used to share the repair resources. Experimental results show that the repair rates of the proposed architecture for clustered or uniformly distributed TSV faults maintain above 99%, far higher than similar method, which indicates that the proposed architecture is well applicable to repairing clustered and uniformly distributed TSV faults.