于璐, 吴礼发, 庄洪林, 沈毅. 基于双向切片的软件漏洞分析技术研究[J]. 微电子学与计算机, 2011, 28(8): 173-175.
引用本文: 于璐, 吴礼发, 庄洪林, 沈毅. 基于双向切片的软件漏洞分析技术研究[J]. 微电子学与计算机, 2011, 28(8): 173-175.
YU Lu, WU Li-fa, ZHUANG Hong-lin, SHEN Yi. Bidirectional-Slicing Based Software Vulnerability Analysis[J]. Microelectronics & Computer, 2011, 28(8): 173-175.
Citation: YU Lu, WU Li-fa, ZHUANG Hong-lin, SHEN Yi. Bidirectional-Slicing Based Software Vulnerability Analysis[J]. Microelectronics & Computer, 2011, 28(8): 173-175.

基于双向切片的软件漏洞分析技术研究

Bidirectional-Slicing Based Software Vulnerability Analysis

  • 摘要: 当前对二进制软件漏洞的分析多基于传统的逆向工程,这种方法很大程度上依赖分析人员的经验,效率低.由此针对二进制软件的实际特点对已有切片技术进行改进,对软件的执行记录进行双向切片,获得导致异常的关键指令序列,只需对关键序列进行少量人工分析即可分析定位异常代码,提高漏洞分析效率.

     

    Abstract: Nowadays the vulnerability analysis for binary software is mainly based on the traditional reversing engineering,which depends on the analyzers' experience and is of low efficiency.This paper makes improvement on existing slicing technology and implementing bidirectional slicing to the binary software trace and obtaining key instruction sequences that lead to the exception.With little human analysis the fault localization can be made,which can improve the vulnerability analysis efficiency.

     

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