The Research and Prospect on Independent and Controllable Key Technologies of Microsystems
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摘要:
微系统技术是后摩尔时代延续摩尔定律重要的解决途径,能够满足电子装备对小型化、多功能电子系统的迫切需求. 由于国内外基础工业条件及布局存在较大差异,无法将国外微系统技术路线全盘复制,应立足国内集成电路产业及封测产业的现状,走适合中国国情的自主可控技术路线. 本文从微系统产品设计、制造及测试的研制流程出发,重点对微系统设计仿真、先进封装和集成测试等方面的关键技术展开研究,形成了自主创新的关键技术解决思路,并提出了微系统的未来发展预判.
Abstract:Microsystem technology is an important way to continue Moore's Law in the post Moore era, which can meet the urgent demand for miniaturized and multi-functional electronic systems in the electronic equipment. Due to the great differences on the conditions and layout between the domestic and overseas fundamental industries, it is impossible to completely duplicate the overseas roadmap on microsystem technology. Based on the current situation of the domestic integrated circuit industry and the packaging and testing industry, we should adopt an independent and controllable technology roadmap that is suitable for China's national situation. This paper is based on the preparation process of the microsystem including the product design, manufacturing and testing. It analyzes the key technologies on system design, simulation, advanced packaging and integrated testing of microsystems. Based on the analyses, the key technologies and solutions for independent innovation are deduced. Additionally, the future development prediction of microsystems is proposed.
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图 2 微焊点层等效计算基本单元和微系统热等效建模网格示意
Figure 2. The unit cell for equivalent calculation of the microbump layer and the thermal equivalent modeling grid diagram for the microsystem
图 3 TSV硅转接板层等效计算体积单元和微系统力学等效建模网格示意
Figure 3. The volume unit cell for equivalent calculation of the TSV silicon substrate and the mechanical equivalent modeling grid diagram for the microsystem
图 4 TSV硅转接板PDN等效电路模型示例
Figure 4. Example of PDN equivalent circuit model for the TSV silicon substrate
图 6 基于晶圆重构的多层TSV堆叠示意
Figure 6. The multi-layers TSV stack based on the wafer reconstruction
图 8 硅基组件ICT飞针互连测试过程
Figure 8. ICT Flying Pin Interconnection Test Process of Silicon Based Modules
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