Research progress of microchannel cooling technology for high-density microsystems
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摘要:
随着电子产品向小型化、多功能、大功率发展以及集成度的不断提高，必然会带来热量更为集中、热流密度不断升高的问题. 为保证可靠工作,实现电子产品,尤其是高密度集成微系统的高效散热就显得尤为重要. 与传统的散热技术相比,微通道散热器可直接集成在器件/系统基板内,制造工艺兼容性好,散热路径短、散热能力强,特别适用于高密度集成微系统的热管控. 本文综述了微通道散热器传热传质特性的表征、影响因素及强化方法。对微通道结构进行优化设计、采用以纳米流体为代表的高性能冷却介质是提高微通道散热器综合散热性能的主要手段. 目前在复杂三维微通道结构的制造及高稳定纳米流体性能调控等方面还存在诸多问题. 深入研究相关制造工艺技术和传热传质机理,将有利于进一步拓展微通道散热技术在高密度集成微系统热管控领域的实际应用.
Abstract:Advances in integrating and packaging technologies have enabled electronic products which are increasingly small, multifunctional and high-powered. High heat flux dissipation becomes one of the key issues to be solved in packaging designs. Compared with traditional cooling technologies, microchannel heat sinks can be directly integrated in the device/system substrates through processing methods compatible with the current mainstream manufacturing processes. The built-in design of the heat sinks can greatly shorten the heat transfer path and largely enhance the cooling effectiveness. Therefore, this cooling technique is particularly suitable for the thermal management of high-density microsystems. The characterization quantities, the influence factors and enhancement methods of heat and mass transport in the microchannel heat sinks are reviewed. Optimizing the microchannel structure and using high-performance coolant, for example nanofluids, are the important ways to improve the overall cooling performance of the microchannel heat sinks. However, there are still many challenges in fabricating complex three-dimensional microchannel structures and controlling the stability and performance of nanofluids. Further research on the manufacturing technology and heat and mass transport mechanisms will help to expand the practical application of the microchannel cooling technique in thermal management of high-density microsystems.
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Key words:
- High-density microsystem /
- microchannel /
- cooling /
- nanofluid
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图 4 不同散热方式对应的热流密度范围[8]
Figure 4. The range of heat flux corresponding to different heat dissipation methods[8]
图 9 纳米流体两步法制备过程及分散稳定性控制方法
Figure 9. The two-step preparation process and dispersion stabilization method of nanofluids
表 1 不同散热方式对比
Table 1. Different heat dissipation methods
散热方式 优点 缺点 自然对流散热 结构简单
运行可靠散热能力弱 强迫液冷散热 散热能力较强 系统结构复杂
体积大
无法满足高密度集成
微系统需求相变散热 结构简单、
无外部功耗散热能力有限
无法满足高密度
集成微系统需求
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表 2 不同拓扑结构微通道的热仿真结果[18]
Table 2. Thermal simulation results of microchannels with various topologies
拓扑结构 芯片最高温度/℃ 压降/kPa 5W 10W 20W 40W 河流网络 29.4 38.8 57.7 95.4 148.1 矩形平直 28.7 37.7 55.3 90.7 97.1 昆虫翅脉 28.3 36.7 53.4 86.7 110.5 叶脉 28.1 36.4 52.7 85.5 96.2 仿蜂窝 27.9 36.2 52.4 84.9 90.8 蜘蛛网 27.6 35.7 51.4 82.8 93.1
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表 3 常压30℃时传统冷却介质的物理参数对比
Table 3. Physical parameters of conventional coolants at atmospheric pressure and 30℃
物化性能 水 乙二醇 导热油
（以煤油为例）液态镓 导热系数W/（m·K） 0.62 0.25 0.15 40.60 比热容kJ/（kg·℃） 4.2 2.7 2.1 0.4 密度/(g/cm3) 1.00 1.10 0.80 5.90 粘度/mPa·s 1.01 1.78 2.01 1.75 沸点/ ℃ 100 197 82 2403 熔点/ ℃ 0 -13 -86 30
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