惯性导航微系统三维集成研究进展

王楷; 孔延梅; 蒋鹏; 杜向斌; 叶雨欣; 鞠莉娜; 曹志勇; 刘瑞文; 焦斌斌

doi:10.19304/J.ISSN1000-7180.2022.0594

惯性导航微系统三维集成研究进展

doi: 10.19304/J.ISSN1000-7180.2022.0594

王楷^{1, 2},
孔延梅²,
蒋鹏³,
杜向斌²,
叶雨欣²,
鞠莉娜^3, ,,
曹志勇^1, ,,
刘瑞文²,
焦斌斌²

1.
湖北大学材料科学与工程学院, 湖北武汉 430062
2.
中国科学院微电子研究所新技术开发部微系统技术实验室, 北京 100029
3.
华东光电集成器件研究所, 江苏苏州 215163

详细信息

作者简介:
王楷：男,（1997-）,硕士研究生. 研究方向为惯性微系统三维集成

孔延梅：女 ,（1982-）,博士,副研究员. 研究方向为MEMS与传感器系统

蒋鹏：男,（1991-）,硕士,工程师. 研究方向为MEMS传感器与微系统

杜向斌：男,（1993-）,硕士,助理工程师. 研究方向为集成电路芯片系统级封装

叶雨欣：男,（1988-）,博士,助理研究员. 研究方向为微系统及散热技术

刘瑞文：男, （1984-）,博士,副研究员. 研究方向为MEMS传感器,微电子机械系统,微细加工技术,微系统集成

焦斌斌：男, （1981-）,博士,研究员. 研究方向为微机电系统设计与加工、传感器信号处理与多传感器融合、微系统集成与散热技术

通讯作者:
女 ,（1980-）,博士,研究员. 研究方向为MEMS传感器与微系统. E-mail：yuanyuan_514@126.com

男,（1972-）,博士,副教授. 研究方向为材料工程与计算机应用. E-mail：caozy@hubu.edu.cn

中图分类号: TN42
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- 被引次数: 0
出版历程
- 收稿日期: 2022-09-26
- 修回日期: 2022-10-19
- 网络出版日期: 2023-01-18

A review on 3D integration of inertial navigation microsystem

WANG Kai^{1, 2},
KONG Yanmei²,
JIANG Peng³,
DU Xiangbin²,
YE Yuxin²,
JU Lina^{3
, ,},
CAO Zhiyong^{1
, ,},
LIU Ruiwen²,
JIAO Binbin²

1.
School of Materials Science and Engineering, Hubei University, Wuhan 430062, China
2.
Microsystem Technology Laboratory, New Technology Development Department, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China
3.
East China Institute of Optoelectronic Integrated Devices, Suzhou 215163 , China

摘要

摘要:
随着“摩尔定律”日趋放缓，微系统封装集成技术成为“超越摩尔”最有前景的技术之一. 惯性微系统技术是在微机电系统（MEMS）基础上,将多种传感器通过异质异构集成技术,在硅基片上进行3D集成,开发出具有多种功能的芯片级的微小型电子系统,实现更高的集成度和更小的体积,并内置算法,实现芯片级导航、定位等功能. 该系统通过自身传感器采集到的数据信息进行自主导航,不受外界环境影响,具有很强的抗干扰能力,呈现出小型化、智能化趋势. 本文主要探讨了惯性微系统的组成部分以及MEMS惯性传感器的常见分类. 通过对国内外研究现状的梳理,重点分析了以第三代集成技术为主的惯性微系统集成的特点和研究进展.文章最后探讨了惯性微系统未来的研究方向和发展趋势.
- MEMS /
- 惯性器件 /
- 微系统 /
- 异质 /
- 定位导航 /
- 三维集成
Abstract:
With Moore’s Law slowing down, microsystem packaging and integration technology has become one of the most promising technologies to “surpass Moore”. Inertial microsystem technology is based on micro-electro-mechanical system (MEMS), which integrates a variety of sensors on silicon substrate through heterogeneous integration technology, and develops microelectronic systems with various functions at chip level. Inertial microsystem technology has higher integration and smaller size. It can achieve chip-level navigation, positioning and other functions through built-in algorithms. The system navigates autonomously through the data collected by its own sensors to avoid being affected by the external environment. Therefore, it has a strong anti-interference ability, showing a trend of miniaturization and intelligence. In this paper, the components of inertial microsystems and the common classification of MEMS inertial sensors are discussed. By sorting out the current situation of domestic and foreign research, the characteristics and research progress of inertial microsystem integration , which are mainly focusing on the third generation integration technology are analyzed. Finally, the future research direction and development trend of inertial microsystems are discussed.
- MEMS /
- Inertial components /
- microsystems /
- heterogeneous /
- navigation and positioning /
- 3D integration

HTML全文

图 1 微系统概念

Figure 1. Microsystem concept

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图 2 MICRO-PNT微系统研究目标

Figure 2. MICRO-PNT microsystem research objectives

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图 3 MEMS惯性传感器集成技术

Figure 3. MEMS inertial sensor integration technology

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图 4 二维微系统集成方MCM案

Figure 4. MCM case of two-dimensional microsystem integration

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图 5 MS9000加速度计的内部视图

Figure 5. Interior view of the MS9000 acceleromete

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图 6 Sensonor公司IBG21陀螺

Figure 6. Sensonor IBG21 gyroscope

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图 7 SiP集成方案

Figure 7. SiP integration scheme

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图 8 组装的SAR500封装图

Figure 8. Assembled SAR500 package diagram

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图 9 基于TSV的三维集成

Figure 9. 3D integration based on TSV

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图 10 三维分立封装技术

Figure 10. 3D discrete packaging technology

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图 11 折叠式MEMS金字塔IMU的原型

Figure 11. Prototype of collapsible MEMS pyramid IMU

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图 12 3-D折叠MEMS IMU结构的制造方法

Figure 12. Manufacturing method of 3-D folded MEMS IMU

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图 13 设想的堆叠封装图

Figure 13. shows the envisioned stack packaging diagram

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图 14 堆叠封装的原理图横截面

Figure 14. Schematic cross section of stack package

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图 15 3D 配置折叠的制造TIMU原型

Figure 15. 3D configuration folded manufacturing TIMU prototype

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表 1 具有SWaP与环境适应性的DARPA AIMS项目指标

Table 1. DARPA AIMS project indicators with SWaP & Survival Metric

SWaP与环境适应性	目标1	目标2
体积/cm³	1	1
重量/g	1	1
功耗/mW	250	250
工作温度范围/℃	−54~+85	−54~+85
抗震性（5 Hz~5 kHz）/g_RMS	50	7.7
抗冲击性/g	50000	20000

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表 2 DARPA新型微惯性传感器AIMS项目指标

Table 2. DARPA new micro-inertial sensor AIMS project indicators

性能参数	陀螺		加速度计
性能参数	目标1	目标2	目标1	目标2
量程/°/s	±100000	±900	±50000	±60
偏置重复性/°/hr	0.01	0.001	10	1
偏置环境灵敏度/°/hr	0.01	2e-5	10	0.5
标度因数重复性/ppm	1	0.01	1	1
标度因素环境灵敏度/ppm	1	1	1	1

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表 3 不同级别陀螺的性能指标

Table 3. Comparison of performance indexes of different levels of gyroscope

性能指标	ADIS16137	ADIS16136	ADXRS649	ADIS16135
测量范围/°/s	1000	480	50000	300
噪声密度/（°/sec/$\sqrt{{\rm{H}}{\textit{{\rm{z}}} } }$）	0.003 6	0.0036	0.25	0.0122
非线性/% FS	0.05	0.1	0.1	0.008
带宽/Hz	400	380	2 000	335
灵敏度/°/sec/LSB	1/6 300	7.139x10⁻⁵	-	0.0125
角速度随机游走/°/$ \sqrt{h} $	0.15	0.167	10.7	0.75
运动中偏置稳定性/°/h	2.8	4	200	6.1
抗冲击性/g	2 000	2 000	10 000	2 000
温度范围/℃	−40~+85	−40~+70	−40~+105	−40~+85
应用范围	精密仪器、平台稳定与控制、机器人	井下仪器、工业车辆导航	工业应用、运动设备	工业车辆导航、精密仪器

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表 4 不同系列加速度计性能指标对比

Table 4. Comparison of performance indexes of different series accelerometers

性能指标	ADXL206	MS9100系列	HS8030系列
测量范围/g	±5	±100	± 30
偏置稳定性/mg	-	15	22
偏置温度系数/（mg/℃）	-	< 5	< 1.5
谐振频率/kHz	5.5	15	6.3
比例因子温度系数/（ppm/℃）	-	100	100
分辨率/mg	1	< 5.5	< 1.7
非线性/% FS	±0.2	< 1	< 0.9
带宽/Hz	0.5~2 500	0~≥100	0~≥100
波段噪声频谱密度/（ug/$\sqrt{{\rm{H}}{\textit{{\rm{z}}} } }$）	110	900	18
工作温度范围/℃	−40~+175	−55~+125	−55~+125
应用范围	航空航天和防务	陆地、海洋和空中应用的精密惯性系统	高冲击惯性测量

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表 5 磁传感器相关特性对比

Table 5. Correlation characteristics of magnetic sensors

性能指标	AMR	GMR	TMR	HALL
灵敏度	较低	较高	高	低
磁场测试范围/Gs	0.001~10	0.1~30	0.001~200	1~1000
温度特性/℃	<150	<150	<200	<150
功耗/mA	1~10	1~10	0.01~0.1	5~20
成本	适中	适中	高	低

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表 6 第三代集成技术的对比

Table 6. Comparison of third generation integration technologies

时间	研究单位	集成特点	相关参数
2011	加州大学Irvine 分校^[41]	采用芯片折叠方式，实现3D空间配置折叠	体积小于0.5 cm³
2013	密歇根大学^[43]	采用熔融石英多层垂直堆叠	体积小于13 mm³ ，Z轴环形陀螺的Q值为33260，谐振频率为90.717 kHz；Y轴加速度计的Q值为852，谐振频率为14.296 kHz.
2015	加州大学Irvine 分校^[44]	采用基于SOI晶圆级的高深宽比的单轴传感器双边制造工艺实现类折纸型的折叠MEMS TIMU微系统	体积小于50 mm³，速度随机游走为0.057 m/s²/$ \sqrt{h} $，偏置不稳定性小于0. 2 mg.
2018	佐治亚理工学院^[45]	采用单芯片集成和晶圆级封装	整体尺寸为4.5 mm×5.5 mm×1 mm，陀螺仪精度优于10 (°) /h，加速度计精度优于100 ug
2019	ADI^[47]	采用三维正交集成	整体模块尺寸为47 mm×44 mm×14 mm，陀螺运动中偏置稳定度为1.8(°)/h，角向随机游走为0.009(°)/h，加速度计量程为士8 g，运动中偏置稳定度为3.6 ug，速度随机游走(VRW)为0.008 m/s² $\sqrt{h} $.
2020	佐治亚理工学院^[48]	采用具有改进纳米间隙传感器设计的密封MEMS单片IMU	角度随机游走为0.06°/$ \sqrt{h} $，偏置不稳定性为0.85°/h；3轴加速度计的带宽大于10 kHz，分辨率低于10 ug/$ \sqrt{H{\textit{z}}} $

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参考文献(57)

[1]	卞玉民, 胡英杰, 李博, 等. MEMS惯性传感器现状与发展趋势[J]. 计测技术,2019,39(4):50-56. DOI: 10.11823/j.issn.1674-5795.2019.04.06. BIAN Y M, HU Y J, LI B, et al. Research status and development trend of MEMS inertial sensor[J]. Metrology & Measurement Technology,2019,39(4):50-56. DOI: 10.11823/j.issn.1674-5795.2019.04.06.
[2]	唐磊, 匡乃亮, 郭雁蓉, 等. 信息处理微系统的发展现状与未来展望[J]. 微电子学与计算机,2021,38(10):1-8. DOI: 10.19304/J.ISSN1000-7180.2021.1098. TANG L, KUANG N L, GUO Y R, et al. The development status and future prospects of information processing microsystem[J]. Microelectronics & Computer,2021,38(10):1-8. DOI: 10.19304/J.ISSN1000-7180.2021.1098.
[3]	何杰, 朴继军, 朱玲瑞, 等. 先进微陀螺器件及微惯性测量单元最新研究进展[J]. 压电与声光,2019,41(3):410-415. DOI: 10.11977/j.issn.1004-2474.2019.03.021. HE J, PIAO J J, ZHU L R, et al. Recent research progress of advanced micro-gyroscope devices and MIMU[J]. Piezoelectrics & Acoustooptics,2019,41(3):410-415. DOI: 10.11977/j.issn.1004-2474.2019.03.021.
[4]	夏艳. 3D集成的发展现状与趋势[J]. 中国集成电路,2011,20(7):23-28. DOI: 10.3969/j.issn.1681-5289.2011.07.002. XIA Y. Present situation and development of 3D integration[J]. China Integrated Circuit,2011,20(7):23-28. DOI: 10.3969/j.issn.1681-5289.2011.07.002.
[5]	薛连莉, 沈玉芃, 徐月. 2019年国外惯性技术发展与回顾[J]. 导航定位与授时,2020,7(1):60-66. DOI: 10.19306/j.cnki.2095-8110.2020.01.009. XUE L L, SHEN Y P, XU Y. Development and review of foreign inertial technology in 2019[J]. Navigation Positioning and Timing,2020,7(1):60-66. DOI: 10.19306/j.cnki.2095-8110.2020.01.009.
[6]	李莉萍. 美国发展中的导航、定位与授时微技术[J]. 计测技术,2015,35(S1):237-241. LI L P. The development of navigation, positioning and timing microtechnology in the United States[J]. Measurement & Measurement Technology,2015,35(S1):237-241.
[7]	LUTWAK R. Emerging microsystem technologies for autonomous positioning, navigation, and timing (PNT)[R]. USA: DARPA/MTO, 2016: 1-31.
[8]	李薇, 席翔, 吴宇列. 定位导航授时微系统技术[J]. 国防科技,2015,36(5):37-41. DOI: 10.13943/j.issn1671-4547.2015.05.08. LI W, XI X, WU Y L. The introduction for micro-system technology for positioning, navigation and timing[J]. National Defense Science & Technology,2015,36(5):37-41. DOI: 10.13943/j.issn1671-4547.2015.05.08.
[9]	李东兵, 杨文钰, 沈玉芃. 美国不依赖GPS的PNT技术发展现状研究[J]. 飞航导弹,2020(12):93-98. DOI: 10.16338/j.issn.1009-1319.20200841. LI D B, YANG W Y, SHEN Y P. PNT technology development status quo of the United States do not rely on GPS research[J]. Aerodynamic Missile Journal,2020(12):93-98. DOI: 10.16338/j.issn.1009-1319.20200841.
[10]	薛连莉, 陈少春, 陈效真. 2017年国外惯性技术发展与回顾[J]. 导航与控制,2018,17(2):1-9. DOI: 10.3969/j.issn.1674-5558.2018.02.001. XUE L L, CHEN S C, CHEN X Z. Development and review of foreign inertial technology in 2017[J]. Navigation and Control,2018,17(2):1-9. DOI: 10.3969/j.issn.1674-5558.2018.02.001.
[11]	JOHN B. LUTWAK R. Emerging microsystem technologies for autonomous positioning, navigation, and timing (PNT)[R]. USA: DARPA/MTO, 2016: 1-31.[C]//23rd Meeting of Space-Based Positioning, Navigation and Timing, The Westin Alexandria Old Town, Alexandria, VA 22314, 2019
[12]	王浩. MEMS陀螺仪传感器专用ASIC简介及设计[J]. 中国集成电路,2019,28(6):44-50. DOI: 10.3969/j.issn.1681-5289.2019.06.008. WANG H. MEMS gyroscope sensor ASIC introduction and design[J]. China Integrated Circuit,2019,28(6):44-50. DOI: 10.3969/j.issn.1681-5289.2019.06.008.
[13]	杨文钰, 李东兵, 隋毅, 等. 2020年国外不依赖卫星的导航技术发展综述[J]. 飞航导弹,2021(1):25-30. DOI: 10.16338/j.issn.1009-1319.20200848. YANG W Y, LI D B, SUI Y, et al. Review on the development of satellite-independent navigation technology abroad in 2020[J]. Aerodynamic Missile Journal,2021(1):25-30. DOI: 10.16338/j.issn.1009-1319.20200848.
[14]	ADIS16137[EB/OL]. [2022-09-13]. https://www.analog.com/media/cn/technical-documentation/data-sheets/ADIS16137_cn.pdf.
[15]	ADIS16136[EB/OL]. [2022-10-12]. https://www.analog.com/media/en/technical-documentation/data-sheets/ADIS16136.pdf.
[16]	ADIS16135[EB/OL]. [2022-10-12]. https://www.analog.com/media/en/technical-documentation/data-sheets/ADIS16135.pdf.
[17]	ADXRS649[EB/OL]. [2022-10-12]. https://www.analog.com/media/en/technical-documentation/data-sheets/ADXRS649.pdf.
[18]	王希望, 王桥, 王晴晴, 等. 基于机器视觉技术的自动爬楼轮椅[J]. 科学技术创新,2022(3):148-151. DOI: 10.3969/j.issn.1673-1328.2022.03.038. WANG X W, WANG Q, WANG Q Q, et al. Automatic building climbing wheelchair based on machine vision technology[J]. Scientific and Technological Innovation,2022(3):148-151. DOI: 10.3969/j.issn.1673-1328.2022.03.038.
[19]	王思远, 韩松来, 任星宇, 等. MEMS惯性导航技术及其应用与展望[J]. 控制与信息技术,2018(6):21-26. DOI: 10.13889/j.issn.2096-5427.2018.06.004. WANG S Y, HAN S L, REN X Y, et al. MEMS inertial navigation technology and its application and prospect[J]. Control and Information Technology,2018(6):21-26. DOI: 10.13889/j.issn.2096-5427.2018.06.004.
[20]	LIU Y, ZHAO Y L, TIAN B, et al. Analysis and design for piezoresistive accelerometer geometry considering sensitivity, resonant frequency and cross-axis sensitivity[J]. Microsystem Technologies,2014,20(3):463-470. DOI: 10.1007/s00542-013-1894-9.
[21]	XIAO D B, LI Q S, HOU Z Q, et al. A novel sandwich differential capacitive accelerometer with symmetrical double-sided serpentine beam-mass structure[J]. Journal of Micromechanics and Microengineering,2016,26(2):025005. DOI: 10.1088/0960-1317/26/2/025005.
[22]	ADXL206[EB/OL]. [2022-10-12]. https://www.analog.com/media/en/technical-documentation/data-sheets/ADXL206.PDF.
[23]	COLIBRYS. MS9000 MEMS accelerometer[EB/OL]. [2022-08-30]. https://www.qinpex.com/singapore/ms9000/.
[24]	COLOBRYS. HS8030 High Shock MEMS Accelerometer[EB/OL]. [2022-08-30]. HS8030 High Shock MEMS Accelerometer-Colibrys-MEMS Accelerometers
[25]	谢华江. 高性能磁性传感器集成微系统技术研究[D]. 成都: 电子科技大学, 2022. XIE H J. High-performance magnetic sensor integrated microsystem technology research[D]. Chengdu: University of Electronic Science and Technology of China, 2022.
[26]	刘钰. 基于TMR传感器阵列的钢丝绳断丝缺陷检测装置及其应用研究[D]. 太原: 太原理工大学, 2019. LIU Y. Research on broken-wire detection device for wire rope based on tmr sensor array and its application[D]. Taiyuan: Taiyuan University of Technology, 2019.
[27]	孙小香. ZnO-Bi₂O₃基压敏陶瓷的电性能优化研究[D]. 南宁: 广西大学, 2014. SUN X X. Studies of the improvement of the electrical properties of the ZnO-Bi₂O₃-based varistor ceramics[D]. Nanning: Guangxi University, 2014.
[28]	李男男, 邢朝洋. 惯性微系统封装集成技术研究进展[J]. 导航与控制,2018,17(6):28-34. DOI: 10.3969/j.issn.1674-5558.2018.06.005. LI N N, XING C Y. Development of inertial micro-system packaging and integration technology[J]. Navigation and Control,2018,17(6):28-34. DOI: 10.3969/j.issn.1674-5558.2018.06.005.
[29]	杨中磊, 朱慧, 周立彦, 等. 2.5D微系统多物理场耦合仿真及优化[J]. 微电子学与计算机,2022,39(7):121-128. DOI: 10.19304/J.ISSN1000-7180.2021.1092. YANG Z L, ZHU H, ZHOU L Y, et al. 2.5D microsystem multiphysics coupling simulation and optimization[J]. Microelectronics & Computer,2022,39(7):121-128. DOI: 10.19304/J.ISSN1000-7180.2021.1092.
[30]	崔凯, 王从香, 胡永芳. 射频微系统2.5D/3D封装技术发展与应用[J]. 电子机械工程,2016,32(6):1-6. DOI: 10.3969/j.issn.1008-5300.2016.06.001. CUI K, WANG C X, HU Y F. Development and application of 2.5D/3D packaging technology for RF microsystem[J]. Electro-Mechanical Engineering,2016,32(6):1-6. DOI: 10.3969/j.issn.1008-5300.2016.06.001.
[31]	马高印, 郭中洋, 刘飞, 等. 基于MCM&SOC方案的微惯性器件系统集成技术综述[J]. 导航定位与授时,2019,6(1):108-115. DOI: 10.19306/j.cnki.2095-8110.2019.01.016. MA G Y, GUO Z Y, LIU F, et al. Review on the system integration technology of micro inertial devices based on the MCM&SOC scheme[J]. Navigation Positioning and Timing,2019,6(1):108-115. DOI: 10.19306/j.cnki.2095-8110.2019.01.016.
[32]	张墅野, 李振锋, 何鹏. 微系统三维异质异构集成研究进展[J]. 电子与封装,2021,21(10):100106. DOI: 10.16257/j.cnki.1681-1070.2021.1009. ZHANG S Y, LI Z F, HE P. Progress on 3D heterogeneous integration of microsystem[J]. Electronics and Packaging,2021,21(10):100106. DOI: 10.16257/j.cnki.1681-1070.2021.1009.
[33]	LAPADATU D, BLIXHAVN B, HOLM R, et al. SAR500-A high-precision high-stability butterfly gyroscope with north seeking capability[C]//Proceedings of the IEEE/ION Position, Location and Navigation Symposium. Indian Wells: IEEE, 2010: 6-13.
[34]	吴向东. 三维集成封装中的TSV互连工艺研究进展[J]. 电子与封装,2012,12(9):1-5. DOI: 10.16257/j.cnki.1681-1070.2012.09.004. WU X D. Research status of through-silicon via interconnection for 3D integration technology[J]. Electronics & Packaging,2012,12(9):1-5. DOI: 10.16257/j.cnki.1681-1070.2012.09.004.
[35]	胡杨, 蔡坚, 曹立强, 等. 系统级封装(SiP)技术研究现状与发展趋势[J]. 电子工业专用设备,2012,41(11):1-6. DOI: 10.3969/j.issn.1004-4507.2012.11.001. HU Y, CAI J, CAO L Q, et al. The research status and development trends of system in package (SiP) technology[J]. Equipment for Electronic Products Manufacturing,2012,41(11):1-6. DOI: 10.3969/j.issn.1004-4507.2012.11.001.
[36]	朱健. 3D堆叠技术及TSV技术[J]. 固体电子学研究与进展,2012,32(1):73-77. DOI: 10.3969/j.issn.1000-3819.2012.01.016. ZHU J. 3D-stack and TSV technology[J]. Research & Progress of SSE,2012,32(1):73-77. DOI: 10.3969/j.issn.1000-3819.2012.01.016.
[37]	李晓阳, 王伟魁, 汪守利, 等. MEMS惯性传感器研究现状与发展趋势[J]. 遥测遥控,2019,40(6):1-13. DOI: 10.13435/j.cnki.ttc.003034. LI X Y, WANG W K, WANG S L, et al. Status and development trend of MEMS inertial sensors[J]. Journal of Telemetry Tracking and Command,2019,40(6):1-13. DOI: 10.13435/j.cnki.ttc.003034.
[38]	赵正平. 微系统三维集成技术的新发展[J]. 微纳电子技术,2017,54(1):1-10. DOI: 10.13250/j.cnki.wndz.2017.01.001. ZHAO Z P. New progress of the micro system three-dimensional integration technology[J]. Micronanoelectronic Technology,2017,54(1):1-10. DOI: 10.13250/j.cnki.wndz.2017.01.001.
[39]	DUAN X M, CAO H L, LIU Z Y. 3D stack method for micro-PNT based on TSV technology[C]//Proceedings of the 2017 IEEE 3rd Information Technology and Mechatronics Engineering Conference (ITOEC). Chongqing: IEEE, 2017: 172-175.
[40]	ZHU W B, ZHANG Y F, YAZDI N. A batch-mode assembly and packaging technology for 3-axis tri-fold inertial measurement units[C]//Proceedings of the 2014 International Symposium on Inertial Sensors and Systems (ISISS). Laguna Beach: IEEE, 2014: 1-4.
[41]	ZOTOV S A, RIVERS M C, TRUSOV A A, et al. Folded MEMS pyramid inertial measurement unit[J]. IEEE Sensors Journal,2011,11(11):2780-2789. DOI: 10.1109/JSEN.2011.2160719.
[42]	闻成. 外军“不依赖GPS导航”技术[J]. 兵器知识,2017(2):68-71. DOI: 10.19437/j.cnki.11-1470/tj.2017.02.017. WEN C. Foreign military "GPS independent navigation" technology[J]. Ordnary Knowledge,2017(2):68-71. DOI: 10.19437/j.cnki.11-1470/tj.2017.02.017.
[43]	CAO Z, YUAN Y, HE G, et al. Fabrication of multi-layer vertically stacked fused silica microsystems[C]//Proceedings of the 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII). Barcelona: IEEE, 2013: 810-813.
[44]	EFIMOVSKAYA A, SENKAL D, ASKARI S, et al. Origami-like folded mems for realization of TIMU: fabrication technology and initial demonstration[C]//Proceedings of the 2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings. Hapuna Beach: IEEE, 2015: 1-4.
[45]	WEN H R, DARUWALLA A, JEONG Y, et al. Wafer-level-packaged HARPSS+ MEMS platform: Integration of robust timing and inertial measurement units (TIMU) on a single chip[C]//Proceedings of the 2018 IEEE/ION Position, Location and Navigation Symposium (PLANS). Monterey: IEEE, 2018: 261-266.
[46]	AYAZI F, WEN H R, JEONG Y, et al. High-Q timing and inertial measurement unit chip (TIMU) with 3D wafer-level packaging[C]//Proceedings of the 2019 IEEE Custom Integrated Circuits Conference (CICC). Austin: IEEE, 2019: 1-8.
[47]	ADI. ADIS16490[EB/OL]. [2022-08-30]. https://www.analog.com/cn/products/adis16490.html.
[48]	AYAZI F, WEN H R, DARUWALLA A, et al. Environmentally-robust high-performance silicon TIMU chip[C]//Proceedings of the 2020 IEEE/ION Position, Location and Navigation Symposium (PLANS). Portland: IEEE, 2020.
[49]	LIN D, MACDONALD R, CALBAZA D, et al. Polaris - a low cost MEMS fabrication platform for navigation-grade inertial sensors[C]//Proceedings of the 2021 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL). Kailua-Kona: IEEE, 2021: 1-4.
[50]	VATANPARVAR D, HII D, SHKEL A M. Fabrication process and structural characterization of fused silica-on-silicon toroidal ring gyroscope[C]//Proceedings of the 2021 IEEE Sensors. Sydney: IEEE, 2021: 1-4.
[51]	LIN Y W, EFIMOVSKAYA A, SHKEL A M. Folded MEMS platform based on polymeric flexible hinges for 3D integration of spatially-distributed sensors[J]. Journal of Microelectromechanical Systems,2021,30(6):907-914. DOI: 10.1109/JMEMS.2021.3109034.
[52]	WANG D M, ASADIAN M H, HII D, et al. Fused silica dual-shell gyroscope with in-plane actuation by out-of-plane electrodes realized using glassblowing and thru-glass-vias fabrication[C]//Proceedings of the 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS). Tokyo: IEEE, 2022: 154-157.
[53]	王巍, 何胜. MEMS惯性仪表技术发展趋势[J]. 导弹与航天运载技术,2009(3):23-28. DOI: 10.3969/j.issn.1004-7182.2009.03.006. WANG W, HE S. Development of MEMS inertial instrument technology[J]. Missiles and Space Vehicles,2009(3):23-28. DOI: 10.3969/j.issn.1004-7182.2009.03.006.
[54]	KHIAL P P, WHITE A D, HAJIMIRI A. Nanophotonic optical gyroscope with reciprocal sensitivity enhancement[J]. Nature Photonics,2018,12(11):671-675. DOI: 10.1038/s41566-018-0266-5.
[55]	GUNDETI V M. Folded MEMS approach to NMRG[D]. Irvine: University of California, 2015.
[56]	陆志东, 余才佳. 微机电系统引领航空技术新变革[J]. 航空科学技术,2012(2):7-11. DOI: 10.3969/j.issn.1007-5453.2012.02.004. LU Z D, YU C J. MEMS will have a huge impact in the aviation industry[J]. Aeronautical Science and Technology,2012(2):7-11. DOI: 10.3969/j.issn.1007-5453.2012.02.004.
[57]	Cold atoms for navigation and other tech recommendations for defense[EB/OL]. [2022-08-22]. http://www.nextgov.com/defense/2013/11/cold-atoms-navigation-and-other-tech-recommendations-defense/74564/.