Abstract: Aiming at the characteristics of high density, high performance and miniaturization of components used in spacecraft, a computer module of aerospace micro system SiP applied to satellite and space station platform is designed in this paper. The design of SiP module needs to solve the problems such as signal interference, unstable power supply system and poor heat dissipation performance. Therefore, in terms of packaging, layout, lamination and wiring design of SiP module, this paper enhances the heat dissipation capacity of the system by using high thermal conductivity packaging materials, enhancing heat dissipation packaging forms and adopting upper and lower cavity layout for chips, and adopts low crosstalk design Low impedance design improves the stability of signal and power supply in the system. Through simulation and verification, the actual working temperature of the module only increases by 25.3℃ under the condition of 125℃; the crosstalk between the most complex signal lines is as low as −37.57 dB; the DC voltage drop, current density and impedance parameters of each power domain are better than the reference indexes.