A new stage for microsystem integration-the integrated development of integrated circuits chips and system-level electronic packaging
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摘要:
拓展摩尔定律已成为集成电路及电子信息通信硬件产业的重大战略之一, 其中微系统技术发展进入全新阶段, 集成电路芯片与集成封装组件的界限日渐模糊, 形成了融合发展的新局面, 正对微系统异质集成技术领域发展产生深远影响.结合团队科研实践, 本文从架构演进、芯片-封装一体化设计策略、多物理域协同分析与优化、集成平台的重大创新等层面, 分析IC与集成封装融合发展阶段的技术特征、内涵与动向, 并对未来应用前景、发展路径进行展望.
Abstract:"More than Moore" has become the preferred strategy for integrated circuit and electronic, information and telecommunication hardware industries and therefore has just promoted microsystem technology onto a new stage, whereon the boundary between IC (integrated circuit) chips and system-level electronic package has become increasingly blurred, triggering a fashion of integrated development of two domain. This new stage is now exerting a far-reaching influence on the development of microsystem heterogeneous integration domain. Consequently, based on the personal scientific research practice, the characteristics, connotations and trends are analyzed and inferred in-depth for this whole new IC-package co-development stage, from the perspective of architecture evolution, chip-package co-design strategy, multi-physics co-analysis and co-optimization, and major technical innovations in integrated assembling and manufacturing; in addition, the future applications are prospected and the path of evolution is suggested.
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